In the world of electronics manufacturing, the BGA (Ball Grid Array) package has become increasingly popular due to its high density and performance advantages. However, the complexity of BGA assembly...
In today's modern world, electronic devices have become an integral part of our lives. From smartphones to laptops, these gadgets have become essential tools for communication, work, and entertain...
Os profissionais que fizeram o trabalho de reformulação da BGA sabem que " aquecimento de" é o pré-requisito para uma reformulação bem sucedida. O processamento de PCB a alta temperatura (315-426°C) por um longo tempo irá bri...
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies.
Visit our cookie policy to learn more.
EN
es 
ko 
de 
it 
ru 
pt 
ar 
vi 
th 
pl