The intelligent, electrified, and networked transformation of automobiles requires constant development of the chip industry and technology. With the accelerated process of vehicle electrification, the improved connectivity of vehicles, and the gradual implementation of autonomous driving, the layout of automobile semiconductors needs to include advanced driving assistance systems (ADAS), image sensors, AI main control, lidar, MEMS, and other prominent "intelligent" semiconductor chips and devices in addition to traditional automobile semiconductors such as microcontrollers, power semiconductor devices, and various sensors.
There are hundreds of chips in intelligent new energy vehicles, and the value of chips continues to increase as a share of the entire vehicle value. In the 1950s, semiconductor products used in automobile manufacturing accounted for less than 1% of total manufacturing costs. New energy vehicles have high requirements for chips, breaking the limits of chip requirements in the entire automobile industry. In the traditional automobile field, there aren't even such high current chips. Currently, the market requires more powerful computing capabilities and more real-time communication chips. From the perspective of autonomous driving and intelligent vehicles, real-time interaction between vehicles and vehicles, vehicles and infrastructure, and vehicles and everything else is necessary, which inevitably requires cars to have extremely high communication and computing capabilities.
Chips have a significant impact on the development of intelligence, and the quality of all chips has always been a concern for major manufacturers. Various defect issues may occur during the process of chip packaging, and chip packaging inspection is an essential process in the production process. Pores and voids are the most common defects in chip packaging, and such defects will affect the chip's heat dissipation and reliability, thereby causing failure. The emergence of X-ray inspection equipment has solved this major problem.
According to the location where pores are generated on the encapsulating body, they can be divided into internal pores and external pores. Pores not only have a significant impact on the appearance of the encapsulating body but also directly affect the reliability of the encapsulated device, especially internal pores. Internal pores cannot be directly seen and must be observed through electronics X-ray machine, which is the most commonly used method for detecting chip defects.
The market requires the void ratio of IC chips to be less than 25%. When the diameter of a single bubbling void or pore is close to the diameter of the aluminum wire, bond pits may be generated on the chip surface, especially for thinner IGBT chips. Therefore, the voids at the bottom of power IC chips should be as low as possible. Currently, the chip companies at the forefront of the industry can produce chips with a void ratio of less than 5%.
At the same time, online electronics X-ray machine can meet the requirements of automated production lines, automatically detecting and analyzing software to reduce manual intervention, improve inspection efficiency, provide intuitive and reliable inspection results, and facilitate data storage and tracking.
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